People want snacks with savory toppings, but repeatable and precise placement of toppings is a high-cost low-volume manual task that mass-production equipment isn’t designed for. Xinova seeks innovative ideas for placing toppings on snacks for high-volume production lines. Different types of equipment use different processes to make snacks like crackers, biscuits or tortillas. Understanding the various processes and equipment involved will inform solutions, which could be applied in the dough or the cooked phase of snacks. The new method should produce 2D patterns of toppings at high throughput and for less or equal cost than current systems.”
We are interested in three types of toppings:
During this 10-minute webinar, RFI manager Jason Guo described disclosure of inventions that allow the purposeful placement of toppings in a specific pattern for high-volume production lines and the scope of this RFI. As always, there was a Q&A after the main presentation.
Visit my.xinova.com for more information
Xinova
PO Box #30873
Seattle, WA 98113
USA
Xinova Japan GK
Yaesu Mitsui Building 6F
2-7-2 Yaesu, Chuo-ku
Tokyo 104-0028 Japan
+81-3-6478-6120
xinova.jp
Xinova Korea
10th floor, Golfzone Tower
735, Yeongdong-daero
Gangnam-gu
Seoul 06072, Korea
+82 2 6952 8840
xinova.co.kr
Xinova Finland
Erottajankatu 5 A 4
FI-00130 Helsinki
Finland
Affiliate offices in Tel Aviv & Vienna